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Ships within 48 hours · Estimated delivery Jul 25 - Jul 30
Rack Slot: 3RU/6HP
Yokogawa AAM11B Current/Voltage Input Module
Ambient Temperature: -20…+70 ºC
ensuring stable performance and enhanced efficiency in demanding applications such as power generation and heavy industry
GE Mark VIe IS210BPPCH1AC I/O Pack Processor Card Fieldbus Expansion Module Rack Slot: 3RU/6HPDescription The IS210BPPCH1AC is an I O Pack Processor Board designed by General Electric for use within the Mark VIe Speedtronic system, specifically for the UCPA (Universal Control Pack Assembly). This board represents an upgrade over the older BPPB input and output packs, featuring newer components and enhanced capabilities. It is important to note that while the IS210BPPCH1AC is designed for the Mark VIe system, the BPPCS1 boards should be used